350759-4 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 10 AMP | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thic