350834-1 - TE Connectivity
Description: Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Contact Features: Contact Layout Matrix | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Multiple Contact Types Without | Contact Underplating Material Thickness 50 MIC