445798-1 - TE Connectivity
Description: Contact Features: Contact Mating Area Plating Material Thickness 50 MICIN | Contact Size Size 8 | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Current Rating (Max) 10 AMP | Contact Type Socket | Contact Base Material Copper Alloy | Operation/Application: Circuit Application Power | Packaging Features: Packaging Quantity 100 | Packaging Method Loose Piece | Termination Features: Product Terminates To Prin