5050865-1 - TE Connectivity
Description: Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Material Gold | Contact Current Rating (Max) 6.5 AMP | Dimensions: Mating Pin Diam