5050935-2 - TE Connectivity
Description: Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 3 AMP | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Base Material Beryllium Copper | Dimensions: PCB Hole Diameter .041 INCH | Wire Size 28 – 25 AWG | PCB Thickness (Rec