60789-3 - TE Connectivity
Description: Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Terminal Type Receptacle | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Terminal Orientation Straight | Contact Underplating Material Thickness 1.27 MICM | Mating Pin Diameter .058 INCH | Mating Pin Diameter 1.47 MM | Terminal Plating Material Gold | Dimensions: Compatible Insulation Diameter Range .045 – .07 INCH | Terminal