MSQA6V1W5T2G - onsemi

Description: Package Designed for Optimal Automated Board Assembly; Corrosion Resistant Finish, Easily Solderable; Low Capacitance (90 pF typical); Small Package Size for High Density Applications; SC88A Package Allows Four Separate Unidirectional Configurations; Void Free, Transfer-Molded, Thermosetting Plastic Case; Low Leakage < 1 mA @ 3 Volt; Breakdown Voltage: 6.1 Volt - 7.2 Volt @ 1 mA; ESD Protection Meeting IEC1000-4-2 Mechanical Characteristics; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable;