NTHC5513T1G - onsemi

Description: Small Size, 40% Smaller than TSOP-6 Package; Leadless SMD Package Featuring Complementary Pair; ChipFET™ Package Provides Great Thermal Characteristics Similar to Larger Packages; Low RDS(on) in a ChipFET™ Package for High Efficiency Performance; Low Profile (< 1.1 mm) Allows Placement in Extremely Thin Environments such as Portable Electronics; Complentary N-Channel and P-Channel MOSFET; RoHS Compliant