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Part Image

S29GL128S90FHI010 - Infineon

Description: NOR Flash Parallel 3V/3.3V 128M-bit 8M x 16 90ns 64-Pin Fortified BGA Tray

Download S29GL128S90FHI010 Model
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PCB Footprints
S29GL128S90FHI010 - Infineon PCB footprint - BGA - BGA - LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm
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3D Models
S29GL128S90FHI010 - Infineon  - 3D model - BGA - LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm
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S29GL128S90FHI010 Details

  • Manufacturer Part Number:

    S29GL128S90FHI010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10.05

  • Access Time-Max:

    90 ns

  • Additional Feature:

    20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

  • Alternate Memory Width:

    1

  • Boot Block:

    BOTTOM/TOP

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    2

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    128

  • Number of Terminals:

    64

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA64,8X8,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Page Size:

    32 words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.4 mm

  • Sector Size:

    128K

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Toggle Bit:

    YES

  • Type:

    NAND TYPE

  • Width:

    11 mm

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S29GL128S90FHI010 Overview

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