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Part Image

XCKU5P-2FFVB676I - XILINX

Description: FPGA - Field Programmable Gate Array XCKU5P-2FFVB676I

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PCB Footprints
XCKU5P-2FFVB676I - XILINX PCB footprint - BGA - BGA - FFVB676
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3D Models
XCKU5P-2FFVB676I - XILINX  - 3D model - BGA - FFVB676
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XCKU5P-2FFVB676I Details

  • Manufacturer Part Number:

    XCKU5P-2FFVB676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    52 Weeks

  • Date Of Intro:

    2016-06-03

  • Manufacturer:

    AMD Xilinx

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    27120

  • Number of Inputs:

    304

  • Number of Logic Cells:

    474600

  • Number of Outputs:

    304

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    27120 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

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XCKU5P-2FFVB676I Overview

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