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TMMH-133-06-F-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-06-F-T |
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1971846-2
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 2 | PCB Mount Orientation Vertical | Keying & Polarized Position Locations 1C, 2D | Number of Rows 1 | Contact Features: Contact Shape & Form Square | Contact Type Tab | Mating Tab Thickness .8 MM | PCB Contact Termination Area Plating Material Thickness 149.6 MICIN | Mating Tab Thickness .032 INCH | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Mating Area Plating Material Silver | Contact Mati | Other | 1971846-2 |
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TMMH-133-01-H-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-01-H-T |
2
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TMMH-133-01-F-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-01-F-T |
2
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TMMH-133-06-TM-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-06-TM-T |
2
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TMMH-133-01-LM-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-01-LM-T |
2
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TMMH-133-01-T-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-01-T-T |
2
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TMMH-133-05-FM-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-05-FM-T |
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TMMH-133-05-F-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-05-F-T |
2
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TMMH-133-04-T-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-04-T-T |
2
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TMMH-133-06-FM-T
SAMTEC
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1 | 99 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-133-06-FM-T |
2
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R523R433050P0K
KEMET
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1 | R52 310 VAC MINI, Film, Metallized Polypropylene, Automotive Safety, 3.3 uF, 10%, 310 VAC, 310 VAC (X2), 310 VAC, 630 VDC, 110°C, -40°C, 110°C, 0.2 % , 99 GOhms, 150 V/us, 2, 15.53 g, 32mm, 28mm, 14mm, Lead Spacing = 27.5mm, 176 | Other | R523R433050P0K |
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R7FS7G27G2A01CBD#AC0
Renesas Electronics
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1 | Designed for high-compute, performance-intensive, networked control applications requiring full memory redundancy, the S7G2 MCU Group has 3 to 4 MB of flash memory and 640 KB of SRAM. Rich in features, it includes a Graphics LCD Controller, 2D Drawing Engine, Capacitive Touch Sensing Unit, advanced analog, Ethernet MAC Controller with IEEE 1588 PTP, USB 2.0 High-Speed and Full-Speed, SDHI, Quad SPI, and safety and security features, to handle a wide range of complexity.Synergy Software Package (SSP)Commerci | BGA | R7FS7G27G2A01CBD#AC0 |
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R7FA6M3AF3CFB#AA0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl | Quad Flat Packages | R7FA6M3AF3CFB#AA0 |
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R7FA6M3AH2CLK#AC0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl | BGA | R7FA6M3AH2CLK#AC0 |
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R7FS5D97C3A01CFP#AA0
Renesas Electronics
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1 | Optimal for HMI applications that require a wide section of connectivity, the S5D9 MCU Group delivers processing performance, supports an Ethernet with PTP controller, and offers up to 2 MB of flash memory and 640 KB of SRAM. It provides analog signal conditioning with Programmable Gain Amplifiers for analog processing, color graphics with a TFTLCD Controller, and a 2D Drawing Engine.Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platfor | Quad Flat Packages | R7FS5D97C3A01CFP#AA0 |
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R7FS5D97C2A01CBG#AC0
Renesas Electronics
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1 | Optimal for HMI applications that require a wide section of connectivity, the S5D9 MCU Group delivers processing performance, supports an Ethernet with PTP controller, and offers up to 2 MB of flash memory and 640 KB of SRAM. It provides analog signal conditioning with Programmable Gain Amplifiers for analog processing, color graphics with a TFTLCD Controller, and a 2D Drawing Engine.Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platfor | BGA | R7FS5D97C2A01CBG#AC0 |
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R7FA6M3AH3CFC#AA0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl | Quad Flat Packages | R7FA6M3AH3CFC#AA0 |
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R7FA6M3AF3CBG#AC0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl | BGA | R7FA6M3AF3CBG#AC0 |
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R8A77343DA0EBG#U0
Renesas Electronics
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0 | The SH7734 has a CPU core with a maximum operating frequency of 533 MHz and on-chip 4-way set-associative cache memory with 32 kilobytes each for instruction and data. The SH7734 is equipped with a built-in 2D graphics accelerator function. As a display controller, it has a built-in display unit that supports RGB888 digital output. A built-in Gigabit Ethernet controller enables high-speed data transfer over a network. Other on-chip peripheral functions include USB 2.0 host/function, a DMA controller, serial | BGA | R8A77343DA0EBG#U0 |
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IW7016-00-SO32
Renesas Electronics
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1 | The iW7016 is a 6-channel LED backlight driver designed to deliver better screen performance and lower cost in next-generation 2D and 3D LCD TVs. It offers a highly integrated feature set, including a DC/DC boost controller with 10V gate drive, high-voltage current sinks, and Renesas' patented BroadLED™ digital current regulation technology to eliminate the need for costly LED binning.The iW7016 offers a broad input voltage range of 9V to 36V and incorporates phase-shifted individual PWM dimming to reduce m | Small Outline Packages | IW7016-00-SO32 |
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QTT-33-04-F-T
SAMTEC
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1 | 99 position, 2.00 mm Power Plane Terminal Strip | Other | QTT-33-04-F-T |
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QTT-133-01-G-T
SAMTEC
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1 | 99 position, 2.00 mm Power Plane Terminal Strip | Other | QTT-133-01-G-T |
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QTT-133-02-G-T
SAMTEC
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1 | 99 position, 2.00 mm Power Plane Terminal Strip | Other | QTT-133-02-G-T |
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QTT-33-03-S-T
SAMTEC
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1 | 99 position, 2.00 mm Power Plane Terminal Strip | Other | QTT-33-03-S-T |
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