Description:Mini-Fit Plus Header, Dual Row, Vertical, 2 Circuits, with Snap-in Plastic Peg PCB Lock, without Drain Holes, PA Polyamide Nylon 6/6, UL 94V-2, Tin (Sn) 1.27µm Over Nickel (Ni) Plating
The recommended mating sequence for the 0460150207 connector is to mate the guide pins first, followed by the signal pins. This ensures proper alignment and prevents damage to the connector.
Yes, the 0460150207 connector is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and fastening procedures to ensure the connector remains secure.
The maximum cable bend radius for the 0460150207 connector is typically 3-5 times the diameter of the cable. However, it's recommended to consult the specific cable manufacturer's guidelines for the most accurate information.
The 0460150207 connector is designed to operate in a wide range of temperatures (-40°C to 105°C) and humidity levels. However, it's essential to consult the datasheet and Molex's environmental specifications to ensure the connector meets the specific requirements of your application.
The recommended torque specification for the 0460150207 connector's screws is typically between 0.5-1.5 Nm. However, it's recommended to consult the datasheet or Molex's documentation for the most accurate information.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
0460150207 Overview
Use the download button to access the 0460150207 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 04601,
or try a keyword search, such as Power Connectors
About Molex
Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.
