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0900BL18B200E - JOHANSON TECHNOLOGY

Description: Signal Conditioning 800-1000 MHz Balun Ceramic Chip

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0900BL18B200E - JOHANSON TECHNOLOGY - PCB symbol
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PCB Footprints
0900BL18B200E - JOHANSON TECHNOLOGY PCB footprint - Other - Other - 0900BL18B200E-1
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0900BL18B200E - JOHANSON TECHNOLOGY - 3D model - Other - 0900BL18B200E-1
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0900BL18B200E Details

  • Manufacturer Part Number:

    0900BL18B200E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    Johanson Technology Inc

  • YTEOL:

    6

  • Cut-off Frequency-Max:

    1000 MHz

  • Cut-off Frequency-Min:

    800 MHz

  • Height:

    0.84 mm

  • Insertion Loss:

    1 dB

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TAPE & REEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Transformer Type:

    RF TRANSFORMER

  • Width:

    1.6 mm

0900BL18B200E Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 0900BL18B200E is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle the component's sensitivity to moisture, it is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
  • The maximum reflow temperature for the 0900BL18B200E is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds.
  • Yes, the 0900BL18B200E is designed for high-frequency applications, with a self-resonant frequency of 1800 MHz and a maximum operating frequency of 2.4 GHz.
  • The recommended soldering process for the 0900BL18B200E is a reflow soldering process with a peak temperature of 250°C, using a solder paste with a melting point of 217°C.

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0900BL18B200E Overview

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