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1-2379397-8 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 74 | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 1 AMP | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch)

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1-2379397-8 Overview

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1-2379397-8 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

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Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

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Transistor Outline, Vertical

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