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118438-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 5 MICIN | Contact Type Socket | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Beryllium Copper | PCB Contact Termination Area Plating Material Gold | Contact Orientation Straight | Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area Plating Material Thickness .127 MICM | Mechanical Atta

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118438-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

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Transistor Outline, Vertical

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