147427-1 - TE Connectivity
Description: Body Features: Primary Product Color Black | PCB Retention Feature Plating Material Tin-Lead over Nickel | Assembly Process Feature Material Aluminum | PCB Retention Feature Material Copper Alloy | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 60 | Board-to-Board Configuration Parallel | Number of Rows 2 | Contact Features: Contact Current Rating (Max) .5 AMP | Mating Pin Diameter .018 INCH | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copp
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