Please enter a minimum 3 letters or numbers
Technical Content
Part Image

173640-3 - TE Connectivity

Description: Contact Features: Contact Underplating Material Nickel | Mating Pin Diameter 1.02 MM | Contact Mating Area Plating Material Gold Flash | Contact Type Pin | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Size Size 20 | Contact Current Rating (Max) 1.1 AMP | Dimensions: Compatible Insulation Diameter Range .8 – 1.3 MM | Wire Size .05 – .15 MMSQ | Compatible Insulation Diameter Range .031 – .051 INCH | Wire Size 30 – 26 AWG | Mechanical Attachment: W

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

173640-3 Overview

No models are available for download for 173640-3. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 17364, or try a keyword search, such as Assembly Items

Parts related to 173640-3

Showing 0 results

Part Image

← Prev Next →

Select Package Category

Quick Jump

- Aluminium Electrolytic Capacitor
- Axial Diameter Horizontal Mount
- BGA
- Chip Array
- Chip Non-Polarised
- Chip Polarised
- Connector
- Dual-In-Line Sockets
- Header, Receptacle
- Header, Shrouded
- Header, Unshrouded
- Moulded Non-Polarised
- Moulded Polarised
- QFN
- QFP-PLCC
- Radial Diameter
- SIL-MIL
- Small Outline Diode
- SON
- SOT
- Transistor Outline, Vertical
- Other

Package Categories

Close
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑