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179841-2 - TE Connectivity

Description: Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 1 MICM | PCB Contact Termination Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Mating Area Plating Material Tin | Contact Type Tab | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN

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179841-2 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

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