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1926731-2 - TE Connectivity

Description: Configuration Features: Number of Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Board-to-Board Configuration Perpendicular | Number of Power Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Type Blade | Contact Current Rating (Max) 16 AMP | Contact Mating Area Plating Material Thickness 3.937 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Gold Flash over

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1926731-2 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

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Chip Polarised

Connector

Dual-In-Line Sockets

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Header, Shrouded

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Moulded Polarised

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QFP-PLCC

Radial Diameter

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