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225860-E - TE Connectivity

Description: Body Features: Terminal Profile Low | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 5 – 10 MICM | Contact Mating Area Plating Material Thickness 5 – 10 MICM | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 196.85 – 393.7 MICIN | Contact Mating Area Plating Material Tin (Sn) | PCB Contact Termination Area Plating Material Thic

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225860-E Overview

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