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225869-E - TE Connectivity

Description: Body Features: Terminal Profile Low | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 1 | Contact Features: Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin (Sn) | PCB Contact Termination Area Plating Material Thickness 196.85 – 393.7 MICIN | Contact Mating Area Plating Material Thickness 5 – 10 MICM | PCB Contact Termination Area Plating Material

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225869-E - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

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Connector

Dual-In-Line Sockets

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Header, Shrouded

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SIL-MIL

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