22R336MC - Murata Electronics

22R336MC Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the 22R336MC?
  Murata recommends a land pattern with a pad size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.5mm between the pad and the solder mask.
• How do I handle the 22R336MC's sensitivity to moisture?
  To prevent moisture-related issues, store the components in a dry environment (less than 20% RH) and follow the recommended baking procedure before reflow soldering. Also, ensure that the PCB is properly cleaned and dried before assembly.
• What is the maximum reflow temperature for the 22R336MC?
  The maximum reflow temperature for the 22R336MC is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. Exceeding this temperature may cause damage to the component.
• Can I use the 22R336MC in a high-vibration environment?
  While the 22R336MC is designed to be robust, it's essential to ensure that the PCB is properly secured and the component is adequately supported to prevent mechanical stress. Consult Murata's application notes for specific guidance on vibration testing and mitigation.
• How do I troubleshoot issues with the 22R336MC's self-resonance frequency?
  To troubleshoot issues with the self-resonance frequency, verify that the component is properly mounted and the PCB layout is optimized for the specific application. Also, check for any nearby components that may be causing electromagnetic interference (EMI). Consult Murata's application notes for specific guidance on layout and design considerations.