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2317123-1 - TE Connectivity

Description: Configuration Features: Board-to-Board Configuration Co-Planar | Number of Power Positions 10 | Number of Positions 10 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Tab | Contact Mating Area Plating Material Thickness 31.49 MICIN | Contact Layout Matrix | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating

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2317123-1 Overview

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