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2332673-3 - TE Connectivity

Description: Configuration Features: Number of Signal Positions 0 | Number of Power Positions 2 | Keying & Polarized Position Locations A | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 20 AMP | Contact Mating Area Plating Material Gold | Contact Type Blade | Wire Contact Termination Area Plating Material Tin over Nickel | Contact Mating Area Plating Material Thickness 1.27 – 2.54 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 50 – 100 MICIN | Dimens

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2332673-3 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

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