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2332791-1 - TE Connectivity

Description: Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Right Angle | Number of Signal Positions 12 | Stackable No | Backplane Architecture Traditional Backplane | Number of Positions 21 | Contact Features: Contact Base Material Copper Alloy | Contact Type Tab | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Mating Area Plating Materia

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2332791-1 Overview

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