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2360229-5 - TE Connectivity

Description: Configuration Features: Number of Positions 124 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .762 MICM | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc

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