Please enter a minimum 3 letters or numbers
Technical Content
Part Image

2366840-4 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Dimensions: Product Width .21

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

2366840-4 Overview

No models are available for download for 2366840-4. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 23668, or try a keyword search

Parts related to 2366840-4

Showing 0 results

Part Image

← Prev Next →

Select Package Category

Quick Jump

- Aluminium Electrolytic Capacitor
- Axial Diameter Horizontal Mount
- BGA
- Chip Array
- Chip Non-Polarised
- Chip Polarised
- Connector
- Dual-In-Line Sockets
- Header, Receptacle
- Header, Shrouded
- Header, Unshrouded
- Moulded Non-Polarised
- Moulded Polarised
- QFN
- QFP-PLCC
- Radial Diameter
- SIL-MIL
- Small Outline Diode
- SON
- SOT
- Transistor Outline, Vertical
- Other

Package Categories

Close
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑