2379397-7 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 74 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .02
ECAD model is currently unavailable for this part
