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374955-E - TE Connectivity

Description: Configuration Features: Board-to-Board Configuration Orthogonal | Number of Positions 5 | PCB Mount Orientation Vertical | Number of Power Positions 5 | Number of Rows 1 | Board-to-Board Configuration Parallel | Insertion Force 5 NEWT | Contact Features: Contact Mating Area Plating Material Gold (Au) | PCB Contact Termination Area Plating Material Thickness 157.48 â€“ 236.22 MICIN | Contact Layout Inline | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 4 â€“ 6 M

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374955-E Overview

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374955-E - TE Connectivity

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374955-E Overview

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

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Moulded Polarised

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QFP-PLCC

Radial Diameter

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