5-5223963-4 - TE Connectivity
Description: Configuration Features: Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Board-to-Board Configuration Perpendicular | Contact Features: Contact Retention Within Housing With | Contact Type Blade | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) 16 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termin
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