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5213815-1 - TE Connectivity

Description: Contact Features: Contact Current Rating (Max) 20 AMP | Contact Fabrication Stamped & Formed | Contact Mating Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness .762 â€“ 1.524 MICM | Dimensions: Wire Size 8 â€“ 10 AWG | Packaging Features: Packaging Method Bag & Box | Product Type Features: Power Terminal Type Termination Point Clip | Termination Features: T

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5213815-1 - TE Connectivity

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Axial Diameter Horizontal Mount

BGA

Chip Array

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Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

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