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583879-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Type Socket | Contact Base Material Phosphor Bronze | Wire Contact Termination Area Plating Material Tin-Lead | Contact Current Rating (Max) 5 AMP | Mechanical Attachment: Contact Retention Type Within Housing Locking Lance | Operation/Application: Circuit Application Power & Signal | Packaging Features: Packa

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583879-1 - TE Connectivity

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Parts related to 583879-1

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other