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5917629-2 - TE Connectivity

Description: Configuration Features: Number of Positions 60 | Number of Rows 2 | Number of Rows 4 | PCB Mount Orientation Vertical | Stackable Yes | Contact Features: Contact Mating Area Plating Material Thickness 118 MICIN | PCB Contact Termination Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | PCB Contact Termination Area Plating Materi

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5917629-2 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

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Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

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Transistor Outline, Vertical

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