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5962-8954801PA - Renesas Electronics

Description: Low noise and high performance are key words describing HA-5102 and HA-5104. These general purpose amplifiers offer an array of dynamic specifications including a 3V/µs slew rate and 8MHz bandwidth. Complementing these outstanding parameters is a very low noise specification of 4. 3nV/√Hz at 1kHz. Fabricated using the Intersil high frequency DI process, these operational amplifiers also offer excellent input specifications such as a 0. 5mV offset voltage and 30nA offset current. Complementing these specific

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5962-8954801PA - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - 14 Ld CERDIP
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5962-8954801PA Details

  • Manufacturer Part Number:

    5962-8954801PA

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    FRIT SEALED, CERDIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    F8.3A

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.325 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.7 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    7.62 mm

5962-8954801PA Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation. A thermal pad on the bottom of the package should be connected to a thermal plane or heat sink.
  • Use a shielded enclosure, keep signal lines short, and use decoupling capacitors. Implement a common-mode choke or ferrite bead on the power lines. Ensure the PCB layout follows good EMC practices, such as separating analog and digital circuits.
  • The power supply should provide a stable 1.2V ±10% output with minimal ripple (<10mV). The VRM should be designed to handle the maximum current requirement of 3.5A. A high-quality, low-ESR capacitor (e.g., 10uF, 1.2V) should be used for power filtering.
  • Use a clock tree with a single, centralized clock source. Implement CDC using asynchronous FIFOs or synchronizers. Ensure clock domain boundaries are clearly defined, and use clock gating to reduce power consumption.
  • Use the IEEE 1149.1 JTAG standard with a TCK frequency of 10MHz. Ensure the JTAG interface is properly terminated, and use a JTAG adapter or pod for debugging. Implement boundary scan cells for testing and debugging.

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5962-8954801PA Overview

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