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621MILFT - Renesas Electronics

Description: The 621 is a low skew, single input to four output, clock buffer. The device operates from a single 1.2 to 1.8 volt supply and has a 3.3 volt tolerant input, making it ideal for level translation. IDT makes many non-PLL and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact us for all of your clocking needs.

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621MILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (SOIC)
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621MILFT - Renesas Electronics  - 3D model - Small Outline Packages - (SOIC)
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621MILFT Details

  • Manufacturer Part Number:

    621MILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    621

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    5 ns

  • Propagation Delay (tpd):

    5 ns

  • Same Edge Skew-Max (tskwd):

    0.15 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

621MILFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated thermal layer and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots. Monitor junction temperature and adjust the system design accordingly.
  • Use a low-ESR capacitor (e.g., 10uF, 100nF) as close to the device as possible. Add a 1uF capacitor in parallel to filter high-frequency noise. Ensure the power supply has a low ripple and noise specification.
  • Use the device's power-saving modes (e.g., idle, sleep) and adjust the clock frequency according to system requirements. Implement a dynamic voltage and frequency scaling (DVFS) scheme to minimize power consumption.
  • Implement a multi-layer ESD protection scheme, including TVS diodes, ESD diodes, and a PCB layout that minimizes signal trace lengths and uses a solid ground plane.

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621MILFT Overview

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