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74FST3257MNTWG - onsemi

Description: RON < 4 Ω Typical; Less Than 0.25 ns-Max Delay Through Switch; Nearly Zero Standby Current; No Circuit Bounce; Control Inputs are TTL/CMOS Compatible; Pin-For-Pin Compatible With QS3257, FST3257, CBT3257; All Popular Packages: QSOP-16, TSSOP-16, SOIC-16; Pb-Free Packages are Available

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74FST3257MNTWG Details

  • Manufacturer Part Number:

    74FST3257MNTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN16, 2.5x3.5, 0.5P

  • Pin Count:

    16

  • Manufacturer Package Code:

    485AW

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.1X.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

74FST3257MNTWG Frequently Asked Questions (FAQs)

  • A good PCB layout for the 74FST3257MNTWG involves keeping the signal traces short and direct, using a solid ground plane, and minimizing vias and layer changes. It's also recommended to use a low-ESR capacitor for power decoupling.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors as needed. Also, consider using a signal integrity analysis tool to simulate and optimize your design.
  • The 74FST3257MNTWG has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Also, consider using thermal interface materials to improve heat transfer.
  • The 74FST3257MNTWG is not a radiation-hardened device. If you need a radiation-hardened solution, consider using a different device or consulting with onsemi's radiation-hardened product line.
  • Use a logic analyzer or oscilloscope to capture waveforms and debug signals. Check for proper power supply, clock, and reset signals. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.

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74FST3257MNTWG Overview

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