826467-9 - TE Connectivity
Description: Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 9 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Gold Flash | Contact Type Pin | Contact Mating Area Plating Material Thickness 31.5 MICIN | Dimensions: Row-to-Row Spacing .1 INCH | PCB Thickness (Recommended) 1.57 MM | Row-to-
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