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82P2282PFG8 - Renesas Electronics

Description: Telecom Interface ICs T1/E1/J1 TRANSCEIVER /DUAL

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82P2282PFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin Plastic Thin Quad Flatpack (PKG100)
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82P2282PFG8 - Renesas Electronics  - 3D model - Quad Flat Packages - 100-Pin Plastic Thin Quad Flatpack (PKG100)
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82P2282PFG8 Details

  • Manufacturer Part Number:

    82P2282PFG8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, TQFP-100

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Carrier Type:

    T-1(DS1)

  • Carrier Type (2):

    T-1(DS1)

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    PCM TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

82P2282PFG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This typically involves powering up the VCCIO and VCC cores in a specific order, followed by the VREF and VDDQ supplies. Refer to the datasheet and application notes for detailed guidance.
  • The 82P2282PFG8 has a thermal design power (TDP) of 2.5W. To manage thermal performance, ensure good airflow, use thermal vias, and consider heat sinks or thermal interface materials (TIMs) if necessary. Renesas provides thermal modeling data and guidelines in their documentation.
  • To ensure proper clock signal integrity, follow Renesas' guidelines for clock signal routing, termination, and jitter attenuation. Use high-quality clock sources, and consider using clock buffers or jitter attenuators if necessary.
  • Renesas provides recommended settings for the PLLs in their datasheet and application notes. These settings may vary depending on the specific application and clock frequencies used. It's essential to follow these guidelines to ensure proper PLL operation and clock signal quality.

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82P2282PFG8 Overview

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