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83026BMI-01LFT - Renesas Electronics

Description: The 83026I-01 is a low skew, 1-to-2 Differential-to- LVCMOS/LVTTL Fanout Buffer. The differential input can accept most differential signal types (LVPECL, LVDS, LVHSTL, HCSL and SSTL) and translate to two single-ended LVCMOS/LVTTL outputs. The small 8-lead SOIC footprint makes this device ideal for use in applications with limited board space.

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83026BMI-01LFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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83026BMI-01LFT - Renesas Electronics  - 3D model - Small Outline Packages - (8 LD SOIC)
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83026BMI-01LFT Details

  • Manufacturer Part Number:

    83026BMI-01LFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    83026

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    3.1 ns

  • Propagation Delay (tpd):

    3.1 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    350 MHz

83026BMI-01LFT Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note (ANXXXX) and ensure a minimum of 2oz copper thickness for the power and ground planes. Additionally, a thermal pad with a thermal conductivity of at least 1 W/m-K is recommended for efficient heat dissipation.
  • To ensure EMC compliance, follow the guidelines outlined in the IEC 61967-1 standard for integrated circuits. Implement proper shielding, grounding, and filtering techniques, and ensure a minimum of 1mm spacing between the device and other components to minimize electromagnetic interference.
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. For power-down, reverse the sequence. Ensure a minimum of 10ms delay between power-up and signal application to allow for internal voltage stabilization.
  • Handle the device in an ESD-controlled environment, wearing an ESD wrist strap or using an ESD mat. Store the device in its original packaging or an anti-static bag, and avoid touching the pins or leads to prevent ESD damage.
  • The 83026BMI-01LFT is manufactured in accordance with Renesas Electronics Corporation's quality and reliability standards, which meet or exceed industry standards such as AEC-Q100 and IATF 16949. Refer to the device's quality and reliability report for detailed information.

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