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85314AGI-11LF - Renesas Electronics

Description: The 85314I-11 is a low skew, high performance 1-to-5 Differential-to-2.5V/3.3V LVPECL fanout buffer. The 85314I-11 has two selectable differential clock inputs. The CLK0, nCLK0 and CLK1, nCLK1 pairs can accept most standard differential input levels. The clock enable is internally synchronized to eliminate runt clock pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 85314I-11 ideal for those applications

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85314AGI-11LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - G Suffix for 20 Lead TSSOP
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85314AGI-11LF - Renesas Electronics  - 3D model - Small Outline Packages - G Suffix for 20 Lead TSSOP
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85314AGI-11LF Details

  • Manufacturer Part Number:

    85314AGI-11LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    85314

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    80 mA

  • Prop. Delay@Nom-Sup:

    1.8 ns

  • Propagation Delay (tpd):

    1.8 ns

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    700 MHz

85314AGI-11LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) for the 85314AGI-11LF, which includes thermal vias, heat sink attachment, and PCB material recommendations.
  • Renesas recommends following the thermal design guidelines, using a heat sink with a thermal resistance of ≤ 10°C/W, and ensuring good airflow around the device. Additionally, consider using thermal interface materials and conformal coatings to enhance thermal performance.
  • Renesas recommends using a low-ESR ceramic capacitor (CIN) with a value of 10-22 μF and a voltage rating of 6.3-10 V. For COUT, use a low-ESR ceramic or electrolytic capacitor with a value of 22-47 μF and a voltage rating of 6.3-10 V. Ensure the capacitors meet the specified ripple current and temperature ratings.
  • Check the PG pin voltage, ensure the input voltage is within the specified range, and verify the output voltage is within the specified tolerance. Also, check for any short circuits, overvoltage, or undervoltage conditions that might affect the PG output.
  • Renesas recommends connecting a capacitor (CSS) with a value of 10-100 nF between the SS pin and GND. This sets the soft-start time to around 1-10 ms. Adjust the capacitor value to achieve the desired soft-start time.

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