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85863-3 - TE Connectivity

Description: Contact Features: PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Thickness .762 MICM | Contact Orientation Horizontal | Contact Mating Area Plating Material Thickness .762 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 3 AMP | Contact Type Socket | Dimensions:

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85863-3 - TE Connectivity

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Parts related to 85863-3

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other