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8T39S06ANBGI - Renesas Electronics

Description: The 8T39S06A is a high-performance clock fanout buffer. The input clock can be selected from two differential inputs or one crystal input. The internal oscillator circuit is automatically disabled if the crystal input is not selected. The crystal pin can be driven by a single-ended clock.The selected signal is distributed to six differential outputs which can be configured as LVPECL, LVDS or HCSL outputs. In addition, an LVCMOS output is provided. All outputs can be disabled into an high-impedance state. Th

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PCB Footprints
8T39S06ANBGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NBG36P1
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8T39S06ANBGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NBG36P1
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8T39S06ANBGI Details

  • Manufacturer Part Number:

    8T39S06ANBGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFPN-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    NBG36P1

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    3.3V SUPPLY ALSO AVAILABLE

  • Family:

    S

  • Input Conditioning:

    MUX

  • JESD-30 Code:

    S-PQCC-N36

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.001 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    110 mA

  • Prop. Delay@Nom-Sup:

    2.8 ns

  • Propagation Delay (tpd):

    2.8 ns

  • Same Edge Skew-Max (tskwd):

    0.08 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • fmax-Min:

    2000 MHz

8T39S06ANBGI Frequently Asked Questions (FAQs)

  • A good PCB layout for the 8T39S06ANBGI involves keeping the power and ground planes separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power and decoupling, connect a 1uF ceramic capacitor between VDD and GND, and a 10uF electrolytic capacitor between VDD and GND. Place these capacitors as close to the device as possible. Also, ensure that the power supply is stable and can provide the required current.
  • The 8T39S06ANBGI can operate at frequencies up to 39.0625 MHz. However, the maximum frequency may vary depending on the specific application and system requirements.
  • The 8T39S06ANBGI is a highly configurable device. To configure it for a specific application, refer to the datasheet and application notes provided by Renesas Electronics Corporation. You may also need to consult with a Renesas support engineer or a qualified design expert.
  • The 8T39S06ANBGI has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within the recommended operating temperature range of -40°C to 85°C. Use thermal vias and a heat sink if necessary to maintain a safe operating temperature.

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