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ASI4UE-G1-SR-7 - Renesas Electronics

Description: The ASI4U is a next-generation CMOS integrated circuit for AS-i networks. This low-level field bus AS i (Actuator Sensor Interface) was designed for easy, safe, and cost-effective interconnection of sensors, actuators, and switches. It transports both power and data over the same two-wire unshielded cable.The ASI4U is used as part of a master or slave node and functions as an interface to the physical bus. It provides the power supply, physical data transfer, and communication protocol handling. The ASI4U i

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ASI4UE-G1-SR-7 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - ssop28_1
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ASI4UE-G1-SR-7 Details

  • Manufacturer Part Number:

    ASI4UE-G1-SR-7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    PYG28

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    33.1 V

  • Supply Voltage-Min:

    16 V

  • Supply Voltage-Nom:

    30 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

ASI4UE-G1-SR-7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 50-ohm impedance-controlled trace for the high-speed signals.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (TIM) to improve heat transfer. Operate within the recommended temperature range (-40°C to 125°C).
  • Power up the device in the following sequence: VCC, then VCCIO, and finally VREF. Ensure that VCC and VCCIO are powered up simultaneously. VREF should be powered up last, after VCC and VCCIO are stable.
  • Use the Power-Down (PD) pin to put the device in low-power mode. Ensure that all inputs are at a valid logic level before powering down. The device will retain its configuration during power-down, but all outputs will be tri-stated.
  • Use ESD protection devices (e.g., TVS diodes) on the input pins to protect against electrostatic discharge. Ensure that the ESD protection devices are rated for the maximum voltage and current of the device.

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ASI4UE-G1-SR-7 Overview

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