AT91SAM9G20B-CU - Microchip

AT91SAM9G20B-CU Details

• Manufacturer Part Number:

  AT91SAM9G20B-CU

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  LFBGA-217

• Pin Count:

  217

• Manufacturer Package Code:

  LFBGA-217

• Country Of Origin:

  Mainland China, Taiwan

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  24 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  14

• Has ADC:

  YES

• Address Bus Width:

  26

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  ARM9

• Clock Frequency-Max:

  50 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B217

• JESD-609 Code:

  e1

• Length:

  15 mm

• Low Power Mode:

  YES

• Number of DMA Channels:

  24

• Number of External Interrupts:

  3

• Number of I/O Lines:

  96

• Number of Serial I/Os:

  1

• Number of Terminals:

  217

• Number of Timers:

  2

• On Chip Data RAM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA217,17X17,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Qualification Status:

  Not Qualified

• RAM (bytes):

  16384

• ROM (words):

  0

• ROM Programmability:

  ROMLESS

• Screening Level:

  TS 16949

• Seated Height-Max:

  1.4 mm

• Speed:

  400 MHz

• Supply Voltage-Max:

  1.1 V

• Supply Voltage-Min:

  0.9 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  15 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC