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AV2511EA24T5Q04 - TE Connectivity

Description: Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Brass | Contact Underplating Material Thickness 50 MICIN | Contact Type Socket | Mating Pin Diameter 1 MM | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .039 INCH | Wire Contact Terminatio

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AV2511EA24T5Q04 Overview

No models are available for download for AV2511EA24T5Q04. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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