Description:Minimum Gain - hFE = 100 @ IC = 150 mA; BD135, BD137, BD139 are complementary with BD136, BD138, BD140; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 1-10uF capacitors with an ESR of 10-50mΩ. For output capacitors, use 10-22uF capacitors with an ESR of 10-50mΩ.
Use a shielded enclosure, keep the device and surrounding components away from the PCB edge, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.
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BD13516STU Overview
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