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BSR41,115 - Nexperia

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BSR41,115 - Nexperia  - 3D model
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BSR41,115 Details

  • Manufacturer Part Number:

    BSR41,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-89

  • Package Description:

    PLASTIC, SC-62, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT89

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JEDEC-95 Code:

    TO-243AA

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

BSR41,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BSR41,115 should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers to reduce thermal resistance. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the maximum junction temperature (Tj) is not exceeded. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK to improve heat transfer.
  • The recommended soldering profile for the BSR41,115 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. A nitrogen atmosphere is recommended to reduce oxidation.
  • To protect the BSR41,115 from ESD, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Use an ESD wrist strap or mat, and avoid touching the device's pins.
  • Store the BSR41,115 in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, with a relative humidity of 60% or less.

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BSR41,115 Overview

Use the download button to access the BSR41,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSR41, or try a keyword search, such as Power Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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