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BZV55C15 - Microsemi Corporation

Description: Diode Zener Single 14.7V 5% 2-Pin DO-213AA

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PCB Footprints
BZV55C15 - Microsemi Corporation PCB footprint - Other - Other - DO-213AA
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3D Models
BZV55C15 - Microsemi Corporation  - 3D model - Other - DO-213AA
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BZV55C15 Details

  • Manufacturer Part Number:

    BZV55C15

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    METALLURGICALLY BONDED

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JEDEC-95 Code:

    DO-213AA

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Voltage Tol-Max:

    6.12%

  • Working Test Current:

    5 mA

BZV55C15 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BZV55C15 is -65°C to 175°C.
  • To ensure reliability, follow proper handling and storage procedures, use a clean and controlled environment, and adhere to recommended soldering and assembly techniques.
  • The BZV55C15 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). Handle the device with ESD-protective equipment and follow proper handling procedures.
  • Yes, the BZV55C15 is designed to be radiation-hardened and can be used in applications requiring resistance to total ionizing dose (TID) and single-event effects (SEE).
  • Use a 0.1 μF to 1 μF ceramic capacitor in close proximity to the device to decouple the power supply and minimize noise.

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