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CM1213-08MR - onsemi

Description: 6 or 8 channels of ESD protection; Channel input capacitance matching of 0.02pF typical is ideal for differential signals; Available in SOIC and MSOP, lead-free packaging

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CM1213-08MR Details

  • Manufacturer Part Number:

    CM1213-08MR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP 10, 3x3

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    846AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clamping Voltage-Max:

    8.8 V

  • Configuration:

    SINGLE, 8 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1213-08MR Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9173/D for more details.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the VIN pin is 30V, but it's recommended to keep it below 24V for optimal reliability and to prevent damage to the internal ESD protection diodes.
  • Yes, but be aware that the device's switching frequency is limited to 100 kHz. Exceeding this frequency may lead to reduced performance, increased power loss, and potential device damage.
  • Implement a robust EOS protection scheme, including TVS diodes, resistors, and capacitors, to prevent damage from voltage transients and ESD events. Refer to the onsemi application note AND9174/D for more information.

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