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DA16200-00000A32 - Renesas Electronics

Description: The DA16200 system-on-chip (SoC) is the world's first Wi-Fi SoC to deliver year-plus battery life for always-connected Wi-Fi IoT devices. DA16200 is a low power Wi-Fi networking SoC that delivers a dramatic breakthrough in battery life even for devices that are continuously connected to the Wi-Fi network. In most applications, one year plus battery life is achievable. There is no tradeoff in output power or range, as the SoC's range is industry-leading. The chip also features very strong IoT security, inclu

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DA16200-00000A32 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Pin QFN
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DA16200-00000A32 - Renesas Electronics  - 3D model - Quad Flat No-Lead - 48-Pin QFN
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DA16200-00000A32 Details

  • Manufacturer Part Number:

    DA16200-00000A32

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    QFN-48

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    11

  • JESD-30 Code:

    S-PQCC-N48

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.25SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.1 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

DA16200-00000A32 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP-AN-DA16200-00000A32-001) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • Renesas recommends a specific power sequencing scheme to ensure proper startup and operation of the DA16200. This involves powering up the VDDIO and VDDCORE pins in a specific order, followed by the VDDPLL pin. Refer to the datasheet and application notes for detailed guidelines.
  • While the datasheet specifies an operating temperature range of -40°C to 85°C, Renesas recommends derating the device's performance at higher temperatures. For reliable operation, it's essential to ensure the device operates within the recommended temperature range and consider thermal management strategies.
  • The DA16200 has multiple low-power modes, including sleep, hibernate, and shutdown modes. To configure these modes, engineers can use the device's registers and control signals. Renesas provides detailed information on low-power mode configuration in their application notes and datasheet.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF or 22uF for the VDDIO, VDDCORE, and VDDPLL pins. The capacitors should be placed as close as possible to the device's power pins to minimize noise and ensure stable operation.

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DA16200-00000A32 Overview

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